Bonding of Ceramic Substrate and CMOS Chip of EBAPS Devices

Hesheng TAN; Mingxin CHEN; Heng ZHAO; Lingyan WANG; Wenbo YANG; Huabing DENG; Yingkun JIN; Yunxiang FENG; Lichun DAO; Kunlin ZHANG

Infrared Technology, Volume. 47, Issue 5, 571(2025)

Hesheng TAN¹, Mingxin CHEN¹, Heng ZHAO^1,2, Lingyan WANG¹, Wenbo YANG¹, Huabing DENG¹, Yingkun JIN¹, Yunxiang FENG¹, Lichun DAO¹, and Kunlin ZHANG^1、*

Author Affiliations

¹North Night Vision Technology Co., Ltd., Kunming 650214, China

²National Key Laboratory of Infrared Detection, Kunming 650223, China

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TAN Hesheng, CHEN Mingxin, ZHAO Heng, WANG Lingyan, YANG Wenbo, DENG Huabing, JIN Yingkun, FENG Yunxiang, DAO Lichun, ZHANG Kunlin. Bonding of Ceramic Substrate and CMOS Chip of EBAPS Devices[J]. Infrared Technology, 2025, 47(5): 571

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Paper Information

Category:

Received: Jan. 20, 2022

Accepted: Jul. 3, 2025

Published Online: Jul. 3, 2025

The Author Email: ZHANG Kunlin (zkl.2004@126.com)

DOI:

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology