Optoelectronic Technology, Volume. 44, Issue 1, 34(2024)

Research on Numerical Simulation of Glue Filling Process

Xumeng QIU1,2, Yunchang CHEN1,2, Sai ZHENG1,2, Junwei TIAN1,2, and Weixian ZHAO1,2
Author Affiliations
  • 1The 55th Research Institute of China Electronics Technology Group Corporation, Nanjing 2006, CHN
  • 2National Flat Panel Display Engineering Technology Research Center, Nanjing 10016, CHN
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    Xumeng QIU, Yunchang CHEN, Sai ZHENG, Junwei TIAN, Weixian ZHAO. Research on Numerical Simulation of Glue Filling Process[J]. Optoelectronic Technology, 2024, 44(1): 34

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    Paper Information

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    Received: Jun. 4, 2023

    Accepted: --

    Published Online: Jul. 18, 2024

    The Author Email:

    DOI:10.12450/j.gdzjs.202401007

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