Optoelectronic Technology, Volume. 44, Issue 1, 34(2024)

Research on Numerical Simulation of Glue Filling Process

Xumeng QIU1...2, Yunchang CHEN1,2, Sai ZHENG1,2, Junwei TIAN1,2, and Weixian ZHAO12 |Show fewer author(s)
Author Affiliations
  • 1The 55th Research Institute of China Electronics Technology Group Corporation, Nanjing 2006, CHN
  • 2National Flat Panel Display Engineering Technology Research Center, Nanjing 10016, CHN
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    Figures & Tables(8)
    Glue filling process
    Viscosity curve changing with reaction time
    Inlet and outlet of glue filling process
    Mesh of glue filling process
    The results of simulation
    Photos of actual results of glue filling process
    Schematic of laminated LCD
    • Table 1. Processing parameters

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      Table 1. Processing parameters

      参数单位数值
      密度kg/m31 020
      粘度Pa·s400
      灌胶速度kg/s0.000 3
      灌胶空腔尺寸mm×mm×mm215×160×1
      排气口尺寸mm×mm4×1
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    Xumeng QIU, Yunchang CHEN, Sai ZHENG, Junwei TIAN, Weixian ZHAO. Research on Numerical Simulation of Glue Filling Process[J]. Optoelectronic Technology, 2024, 44(1): 34

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    Paper Information

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    Received: Jun. 4, 2023

    Accepted: --

    Published Online: Jul. 18, 2024

    The Author Email:

    DOI:10.12450/j.gdzjs.202401007

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