Journals Articles Conferences News About CLP
Submit a paper Email Alert
Search
Search
Articles
Journals
News
Advanced Search
Top Searches
2D MaterialsTransformation opticsQuantum PhotonicsSmall lasersSemiconductor UV PhotonicsSupersymmetric microring laser arrays

Laser & Optoelectronics Progress, Volume. 53, Issue 12, 122301(2016)

Structure of Chip Scale Package for LED Light Source and Its Thermal Performance Analysis Based on Numerical Simulation

Liu Chao1、*, Fu Renli1, Gu Xiguang1, Zhou Ming2, Tian Yang2, and Cai Junde1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
    • show less
    AbstractGet PDF(in Chinese)
    Figures&Tables (0)
    Equations (0)
    References (21)
    Cited By (6)
    Tools
    Paper Information
    Topics
    Figures & Tables(0)
    Tools

    Get Citation

    Copy Citation Text

    Liu Chao, Fu Renli, Gu Xiguang, Zhou Ming, Tian Yang, Cai Junde. Structure of Chip Scale Package for LED Light Source and Its Thermal Performance Analysis Based on Numerical Simulation[J]. Laser & Optoelectronics Progress, 2016, 53(12): 122301

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Set citation alerts for article
    Save article for my favorites
    Paper Information

    Category: Optical Devices

    Received: Aug. 2, 2016

    Accepted: --

    Published Online: Dec. 14, 2016

    The Author Email: Liu Chao (lc0352@163.com)

    DOI:10.3788/lop53.122301

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology