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Laser & Optoelectronics Progress, Volume. 53, Issue 12, 122301(2016)

Structure of Chip Scale Package for LED Light Source and Its Thermal Performance Analysis Based on Numerical Simulation

Liu Chao1、*, Fu Renli1, Gu Xiguang1, Zhou Ming2, Tian Yang2, and Cai Junde1
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    Article index updated: Sep. 15, 2025

    The article is cited by 6 article(s) CLP online library. (Some content might be in Chinese.)
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    Liu Chao, Fu Renli, Gu Xiguang, Zhou Ming, Tian Yang, Cai Junde. Structure of Chip Scale Package for LED Light Source and Its Thermal Performance Analysis Based on Numerical Simulation[J]. Laser & Optoelectronics Progress, 2016, 53(12): 122301

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    Paper Information

    Category: Optical Devices

    Received: Aug. 2, 2016

    Accepted: --

    Published Online: Dec. 14, 2016

    The Author Email: Liu Chao (lc0352@163.com)

    DOI:10.3788/lop53.122301

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology