Fig. 1. (a) Schematic of sampling direction; (b) schematic of thermal deformation process

Fig. 2. Flow stress-strain curves under different deformation temperatures. (a) 750 ℃; (b) 800 ℃; (c) 850 ℃; (d) 900 ℃

Fig. 3. (a) Peak flow stress and (b) softness value of flow stress under different thermal deformation conditions

Fig. 4. Relationship between peak flow stress and strain rate. (a) lnε·-lnσ; (b) lnε·-σ

Fig. 5. Relationship curves. (a) lnε·-ln[sinh(ασ)]; (b) ln[sinh(ασ)]-T-1

Fig. 6. Thermal working maps based on Prasad criterion. (a) ε=0.1; (b) ε=0.2; (c) ε=0.3; (d) ε=0.4; (e) ε=0.5; (6) ε=0.6

Fig. 7. Microstructures under different thermal deformation conditions. (a) As-deposited state; (b) ε·=0.001 s-1,T=750 ℃; (c) ε·=0.001 s-1, T=800 ℃; (d) ε·=0.001 s-1, T=850 ℃; (e) ε·=0.001 s-1, T=900 ℃

Fig. 8. EBSD test results of deformed specimen under condition of ε·=0.001 s-1 and T=900 ℃

Fig. 9. Microstructures of treated specimen under different conditions. (a) As-deposited state; (b) T=750 ℃, ε·=1 s-1; (c) T=850 ℃, ε·=0.001 s-1