Mechanical Reliability Issues and Research Progress of Through Glass Via Technology

MA Xiaohan; DONG Ruipeng; WAN Xin; JIA Fengrui; LONG Xu

doi:10.16257/j.cnki.1681-1070.2025.0160

Electronics and Packaging, Volume. 25, Issue 7, 70109(2025)

Mechanical Reliability Issues and Research Progress of Through Glass Via Technology

MA Xiaohan¹, DONG Ruipeng¹, WAN Xin², JIA Fengrui², and LONG Xu^1,2、*

¹Research Center for Advanced Electronic Packaging Materials and Structures, School of Mechanics and Transportation Engineering, Northwestern Polytechnical University, Xi'an 710021, China

²Yangtze Delta Region Institute of Tsinghua University, Jiaxing 314006, China

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MA Xiaohan, DONG Ruipeng, WAN Xin, JIA Fengrui, LONG Xu. Mechanical Reliability Issues and Research Progress of Through Glass Via Technology[J]. Electronics and Packaging, 2025, 25(7): 70109

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Paper Information

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Received: May. 23, 2025

Accepted: Aug. 26, 2025

Published Online: Aug. 26, 2025

The Author Email: LONG Xu (xulong@nwpu.edu.cn)

DOI:10.16257/j.cnki.1681-1070.2025.0160

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