With the continuous development of integrated circuits towards high density and performance, through glass via (TGV) interconnection technology has shown broad prospects for applications in three-dimensional electronic packaging, integrated passive devices, and optoelectronic device integration due to its advantages of excellent electrical and optical properties, excellent mechanical reliability, and low cost. A comprehensive review of the application background, manufacturing process, material selection, and key mechanical challenges of TGV in chip packaging is provided. The advantages of TGV over through silicon via technology are summarized in terms of cost, electrical performance, and mechanical stability. The manufacturing process of TGV and glass panel is elaborated in detail, and the differences of mechanical properties among commonly adopted glass materials (silicate glass, quartz glass, and borosilicate glass) are highlighted. A detailed discussion of the mechanical challenges faced by TGV technology is presented, along with potential solutions. The research results can provide a theoretical and engineering reference for optimizing TGV structures and designing high-reliability packaging in future applications.