Journal of Terahertz Science and Electronic Information Technology , Volume. 23, Issue 6, 583(2025)

Study on the uniformity of cable insulation layer thickness using terahertz pulse imaging

CHEN Siyang1, CHENG Cheng1, and ZHAI Di2
Author Affiliations
  • 1State grid Ningxia Ultrahigh Voltage Company, Yingchuan Ningxia 750011, China
  • 2State Grid Smart Grid Research Institute Co., Ltd, Beijing 102209, China
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    References(7)

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    [11] [11] TAKAHASHI S, HAMANO T, NAKAJIMA K, et al. Observation of damage in insulated copper cables by THz imaging[J]. NDT & E International, 2014(61): 75-79. DOI: 10.1016/j.ndteint.2013.10.004.

    [12] [12] YAN Zhijin, SHI Wei, HOU Lei, et al, et al. Investigation of aging effects in cross-linked polyethylene insulated cable using terahertz waves[J]. Materials Research Express, 2017, 4(1): 015304. DOI: 10.1088/2053-1591/aa5237.

    [13] [13] LI Shuaibing, CAO Binglei, KANG Yongqiang, et al. Nonintrusive inspection of moisture damp in composited insulation structure based on terahertz technology[J]. IEEE Transactions on Instrumentation and Measurement, 2021(70): 1-10. DOI: 10.1109/TIM.2021.3117360.

    [14] [14] LEE I S, LEE J W. Nondestructive internal defect detection using a CW-THz imaging system in XLPE for power cable insulation[J]. Applied Sciences, 2020, 10(6): 2055. DOI: 10.3390/app10062055.

    [18] [18] ZHANG Zhenwei, XU Jing, JIA Rui, et al. Terahertz non-destructive testing and imaging of high-voltage cables[J]. Frontiers in Physics, 2022(10): 893145. DOI: 10.3389/fphy.2022.893145.

    [19] [19] LI Guowei, ZENG Siming, WANG Qing, et al. Distribution network cable detection based on terahertz pulse and imaging[J]. Russian Journal of Nondestructive Testing, 2024, 60(3): 318-325. DOI: 10.1134/S1061830923601472.

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    CHEN Siyang, CHENG Cheng, ZHAI Di. Study on the uniformity of cable insulation layer thickness using terahertz pulse imaging[J]. Journal of Terahertz Science and Electronic Information Technology , 2025, 23(6): 583

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    Paper Information

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    Received: Oct. 15, 2024

    Accepted: Jul. 30, 2025

    Published Online: Jul. 30, 2025

    The Author Email:

    DOI:10.11805/tkyda2024558

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