Laser & Optoelectronics Progress, Volume. 62, Issue 6, 0611001(2025)
Ultrasonic Phased Array Technology for Defect Imaging and Classification Using PCI-SVM
Fig. 3. Schematic diagrams of defects. (a) Aluminum test piece with pitting corrosion; (b) aluminum test piece with cracks
Fig. 4. Defect images. (a) TFM image with pitting; (b) TFM image with cracks; (c) PCI image with pitting; (d) PCI image with cracks
Fig. 5. Phase information diagrams of No.4 pitting defect in width direction. (a) Phase value; (b) phase value difference
Fig. 6. Horizontal amplitudes at different depths in images containing pitting and crack defects. (a) 400 mm (pitting); (b) 600 mm (pitting); (c) 400 mm (crack); (d) 460 mm (crack)
Fig. 9. Accuracy of SVM image defect classification under different kernel functions. (a) Different dataset types; (b) before and after data enhancement
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Haoqian Zhang, Kai Zhao. Ultrasonic Phased Array Technology for Defect Imaging and Classification Using PCI-SVM[J]. Laser & Optoelectronics Progress, 2025, 62(6): 0611001
Category: Imaging Systems
Received: Jun. 20, 2024
Accepted: Aug. 1, 2024
Published Online: Mar. 12, 2025
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CSTR:32186.14.LOP241523