Journals Articles Conferences News About CLP
Submit a paper Email Alert
Search
Search
Articles
Journals
News
Advanced Search
Top Searches
2D MaterialsTransformation opticsQuantum PhotonicsSmall lasersSemiconductor UV PhotonicsSupersymmetric microring laser arrays

Chinese Journal of Lasers, Volume. 50, Issue 16, 1602401(2023)

High‑Uniformity Ultra‑Fast Laser Beam Splitting and Precision Machining Based on Hybrid Algorithm

Lei Yang1, Xinyu Xu1, Jianlei Wang3, Yunxia Ye1,2、*, Xudong Ren1, and Weibiao Chen3
Author Affiliations
  • 1School of Mechanical Engineering, Jiangsu University, Zhenjiang 212013, Jiangsu, China
  • 2Institute of Micro-nano Optoelectronics and Terahertz Technology,Jiangsu University, Zhenjiang 212013, Jiangsu, China
  • 3Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences,Shanghai 201800, China
    • show less
    AbstractGet PDF(in Chinese)
    Figures&Tables (16)
    Equations (0)
    References (30)
    Cited By (1)
    Tools
    Paper Information
    Topics
    Figures & Tables(16)
    Picosecond laser parallel processing system based on spatial light modulator

    Fig. 1. Picosecond laser parallel processing system based on spatial light modulator

    Download full size
    Flowchart of GS algorithm

    Fig. 2. Flowchart of GS algorithm

    Download full size
    Flowchart of GS-GA algorithm

    Fig. 3. Flowchart of GS-GA algorithm

    Download full size
    Flowchart of feedback GS-GA algorithm

    Fig. 4. Flowchart of feedback GS-GA algorithm

    Download full size
    Influence of zero-order beam and its elimination method. (a) Effect of zero-order beam on multi-beam splitting; (b) effect of zero-order beam on processing; (c) zero-order beam elimination method

    Fig. 5. Influence of zero-order beam and its elimination method. (a) Effect of zero-order beam on multi-beam splitting; (b) effect of zero-order beam on processing; (c) zero-order beam elimination method

    Download full size
    Beam splitting effects of three algorithms captured by camera. (a1)(a2)(a3) GS algorithm; (b1)(b2)(b3) GS-GA algorithm;(c1)(c2)(c3) feedback GS-GA algorithm

    Fig. 6. Beam splitting effects of three algorithms captured by camera. (a1)(a2)(a3) GS algorithm; (b1)(b2)(b3) GS-GA algorithm;(c1)(c2)(c3) feedback GS-GA algorithm

    Download full size
    Beam splitting processing effects of three different algorithms. (a1)(a2)(a3) GS algorithm; (b1)(b2)(b3) GS-GA algorithm;(c1)(c2)(c3) feedback GS-GA algorithm

    Fig. 7. Beam splitting processing effects of three different algorithms. (a1)(a2)(a3) GS algorithm; (b1)(b2)(b3) GS-GA algorithm;(c1)(c2)(c3) feedback GS-GA algorithm

    Download full size
    Ways to selecting holes. (a) Serial numbers of holes under cross arrangement; (b) serial numbers of holes under annular arrangement; (c) serial numbers of holes under 8×8 array arrangement

    Fig. 8. Ways to selecting holes. (a) Serial numbers of holes under cross arrangement; (b) serial numbers of holes under annular arrangement; (c) serial numbers of holes under 8×8 array arrangement

    Download full size
    Machining hole diameters and depths obtained by three algorithms. (a) Machining hole diameter under cross arrangement; (b) machining hole depth under cross arrangement.(c) machining hole diameter under annular arrangement; (d) machining hole depth under annular arrangement; (e) machining hole diameter under 8×8 array arrangement; (f) machining hole depth under 8×8 array arrangement

    Fig. 9. Machining hole diameters and depths obtained by three algorithms. (a) Machining hole diameter under cross arrangement; (b) machining hole depth under cross arrangement.(c) machining hole diameter under annular arrangement; (d) machining hole depth under annular arrangement; (e) machining hole diameter under 8×8 array arrangement; (f) machining hole depth under 8×8 array arrangement

    Download full size
    Processing effects of 10×10 beam array generated by feedback GS-GA algorithm on aluminum sample. (a) Full view of aluminum sample after processing; (b) 3D morphology of hole array; (c) depth of first row of holes; (d) depth of fifth row of holes; (e) depth of sixth row of holes; (f) depth of tenth row of holes

    Fig. 10. Processing effects of 10×10 beam array generated by feedback GS-GA algorithm on aluminum sample. (a) Full view of aluminum sample after processing; (b) 3D morphology of hole array; (c) depth of first row of holes; (d) depth of fifth row of holes; (e) depth of sixth row of holes; (f) depth of tenth row of holes

    Download full size

    • Table 1. Main parameters of picosecond laser

      View table

      Table 1. Main parameters of picosecond laser

      ParameterSpot diameterWavelengthPulse durationFrequency

      Linear

      polarization degree

      Beam

      quality

      		Beam mode
      Content3 mm1064 nm15 ps500 kHz100∶1M2<1.3TEM00

    • Table 2. Main parameters of spatial light modulators

      View table

      Table 2. Main parameters of spatial light modulators

      ParameterResolution

      Pixel

      pitch

      Effective

      area

      		Fill factorInput signal levelRecommended average powerRefresh rate
      Value1272 pixel×1024 pixel12.5 μm15.9 mm×12.8 mm96%256≤100 W60 Hz

    • Table 3. Running time of GS algorithm, GS-GA algorithm and feedback GS-GA algorithm

      View table

      Table 3. Running time of GS algorithm, GS-GA algorithm and feedback GS-GA algorithm

      Beam

      arrangement

      		GS algorithmGS-GA algorithmFeedback GS-GA algorithm
      Runtime

      Number of

      iterations

      		RuntimeNumber of population updatesRuntimeNumber of population updates
      Cross<1 min453.5 h226 h28
      Circle<1 min503 h195 h25
      8×8 array<1 min436.5 h4014.5 h57

    • Table 4. Energy uniformity of split beams generated by GS algorithm, GS-GA algorithm, and feedback GS-GA algorithm under different arrangements

      View table

      Table 4. Energy uniformity of split beams generated by GS algorithm, GS-GA algorithm, and feedback GS-GA algorithm under different arrangements

      Beam

      arrangement

      Uniformity of

      GS algorithm /%

      Uniformity of

      GS-GA algorithm /%

      		Uniformity of feedback GS-GA algorithm /%
      Cross64.382.393.8

      Circle

      8×8 array

      75.8

      59.4

      84.2

      68.3

      95.1

      94.5

    • Table 5. Machining hole diameter uniformity obtained through GS algorithm, GS-GA algorithm, and feedback GS-GA algorithm under different arrangements

      View table

      Table 5. Machining hole diameter uniformity obtained through GS algorithm, GS-GA algorithm, and feedback GS-GA algorithm under different arrangements

      Beam

      arrangement

      		Hole diameter uniformityI1I2
      GS algorithmGS-GA algorithmFeedback GS-GA algorithm
      Cross65.3%80.6%92.5%14.8%41.7%
      Annular70.8%83.1%93.7%12.8%32.3%
      8×8 array52.9%67.1%94.3%40.5%72.9%

    • Table 6. Machining hole depth uniformity obtained through GS algorithm, GS-GA algorithm, and feedback GS-GA algorithm under different arrangements

      View table

      Table 6. Machining hole depth uniformity obtained through GS algorithm, GS-GA algorithm, and feedback GS-GA algorithm under different arrangements

      Beam

      arrangement

      		Hole depth uniformityI3I4
      GS algorithmGS-GA algorithmFeedback GS-GA algorithm
      Cross60.2%74.3%85.1%14.5%40.1%
      Annular63.0%77.2%86.7%12.3%37.6%
      8×8 array59.4%74.7%85.1%13.9%43.3%
    Tools

    Get Citation

    Copy Citation Text

    Lei Yang, Xinyu Xu, Jianlei Wang, Yunxia Ye, Xudong Ren, Weibiao Chen. High‑Uniformity Ultra‑Fast Laser Beam Splitting and Precision Machining Based on Hybrid Algorithm[J]. Chinese Journal of Lasers, 2023, 50(16): 1602401

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Set citation alerts for article
    Save article for my favorites
    Paper Information

    Category: Laser Micro-Nano Manufacturing

    Received: Dec. 19, 2022

    Accepted: Mar. 7, 2023

    Published Online: Jul. 18, 2023

    The Author Email: Ye Yunxia (yeyunxia@ujs.edu.cn)

    DOI:10.3788/CJL221543

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology