Regulation Study of Stress Buffer Layer on the Internal Stress and Reliability of Glass Substrate Hole-Filling Structures

WANG Zhanbo; ZHANG Zexi; YANG Bin; GUO Xu; YANG Guannan; ZHANG Yu; HUANG Guanghan; CUI Chengqiang

doi:10.16257/j.cnki.1681-1070.2025.0122

Electronics and Packaging, Volume. 25, Issue 7, 70103(2025)

Regulation Study of Stress Buffer Layer on the Internal Stress and Reliability of Glass Substrate Hole-Filling Structures

WANG Zhanbo, ZHANG Zexi, YANG Bin, GUO Xu, YANG Guannan^*, ZHANG Yu, HUANG Guanghan, and CUI Chengqiang

Author Affiliations

State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, Guangdong University of Technology, Guangzhou 510006, China

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WANG Zhanbo, ZHANG Zexi, YANG Bin, GUO Xu, YANG Guannan, ZHANG Yu, HUANG Guanghan, CUI Chengqiang. Regulation Study of Stress Buffer Layer on the Internal Stress and Reliability of Glass Substrate Hole-Filling Structures[J]. Electronics and Packaging, 2025, 25(7): 70103

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Paper Information

Special Issue:

Received: Feb. 28, 2025

Accepted: Aug. 26, 2025

Published Online: Aug. 26, 2025

The Author Email: YANG Guannan (ygn@gdut.edu.cn)

DOI:10.16257/j.cnki.1681-1070.2025.0122

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