Journal of Infrared and Millimeter Waves, Volume. 39, Issue 4, 417(2020)
Fig. 1. device structure diagram (a) two-dimensional cross-sectional view, and (b) three-dimensional perspective view:(a) (b)
Fig. 2. surface morphology view of a device etched with microcolumn array under SEM (a) top view, and (b) side view
Fig. 3. surface reflectivity of three devices flat silicon, with microcolumn array etched on the surface and Al2O3 grown on the microcolumns
Fig. 4. the
Fig. 5. comparison of photocurrent of three devices under 0.1
Fig. 6. comparison of light responsivity of three kinds of devices under the same illumination intensity and bias at 808
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Yu-Ling TANG, Shao-Jie XIA, Jun CHEN.
Category: Materials and Devices
Received: Dec. 8, 2019
Accepted: --
Published Online: Sep. 17, 2020
The Author Email: Jun CHEN (junchen@suda.edu.cn)