[1] [1] HONG B Z, RAY S K. Ceramic column grid array technology with coated solder columns ［C］// Proceed 50th ECTC. Seattle, WA, USA. 2000: 1347-1353.

[5] [5] GHAFFARIAN R. CCGA package for space application ［J］. Microelec Reliab, 2006, 46(12): 2006-2024.

[7] [7] COFFIN L F. A study of the effect of cyclic thermal stresses on a ductile metal ［J］. Trans American Society Mechan Engineers, 1954, 76: 931-950.

[8] [8] MANSON S S. Behavior of materials under conditions of thermal stress ［J］. National Advis Comm Aero, 1953, 2933: 1-34.

[9] [9] SOLOMON H D. Low cycle fatigue of 60/40 solder-plastic strain limited versus displacement limited testing ［J］. Electronic Packag: Mater Process, 1985: 29-47.

[10] [10] ENGELMAIER W. Fatigue life of leadless chip carrier solder joints during power cycling ［J］. IEEE Trans Compon Hybrids Manufactur Tech, 1983, 6(3): 232-237.

[11] [11] KNECHT S, FOX L R. Constitutive relation and creep-fatigue life model for eutectic tin-lead solder ［J］. IEEE Trans Compon Hybrids Manufactur Tech, 1990, 13(2): 424-433.

[12] [12] SYED A R. Creep crack growth prediction of solder joints during temperature cycling -an engineering approach ［J］. Trans American Soc Mechan Engineer, 1995, 117(6): 116-122.

[13] [13] AKAY H U, PAYDAR N H, BILGIC A. Fatigue life predictions for thermally loaded solder joints using a volume-weighted averaging technique ［J］. Trans American Soc Mechan Engineer, 1997, 119(12): 228-235.

[14] [14] DARVEAUX R. Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction ［J］. Trans American Soc Mechan Engineer, 2002, 124(9): 116-122.

[15] [15] PAO Y H. A fracture mechanics approach to thermal fatigue life prediction of solder joints ［J］. IEEE Trans Compon Hybrids Manufactur Tech, 1992, 15(4): 559-570.

[17] [17] PERKINS A, SITARAMAN S K. Thermo-mechanical failure comparison and evaluation of CCGA and ABGA electronic package ［C］// Electronic Compon Techn Conf. Seattle, WA, USA. 2003: 422-430.

[19] [19] DARVEAUX R. Effect of simulation methodology on solder joint crack growth correlation and fatigue life prediction ［J］. J Electronic Packag, 2002, 124(3): 147-154.

[20] [20] SOLOMON H D. Fatigue of 60/40 solder ［J］. IEEE Trans Compon Hybrids Manufactur Tech, 1986, 9(4): 423-432.

[21] [21] STRICKLAN S M, HESTER J D, GOWAN A K, et al. Microcoil spring interconnects for ceramic grid array integrated circuits ［Z］. NASA Tech Memorandum, 2011.