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Microelectronics, Volume. 52, Issue 3, 503(2022)

Simulation Study on Thermal Fatigue Life of Microcoil Spring CCGA Solder Column Under Temperature Cycle

ZOU Zhenxing1, ZHANG Zhenyue1, WANG Jianfeng1, ZHU Sixiong1, and CAO Jiali2
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    ZOU Zhenxing, ZHANG Zhenyue, WANG Jianfeng, ZHU Sixiong, CAO Jiali. Simulation Study on Thermal Fatigue Life of Microcoil Spring CCGA Solder Column Under Temperature Cycle[J]. Microelectronics, 2022, 52(3): 503

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    Received: Sep. 6, 2021

    Accepted: --

    Published Online: Jan. 18, 2023

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.210343

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology