Infrared and Laser Engineering, Volume. 51, Issue 8, 20210721(2022)

Research on the package structure of deep low-temperature and high-power resistor array

Quan Sun1,2,3, Defeng Mo1,2, Dafu Liu1,2, and Haimei Gong1,2
Author Affiliations
  • 1State Key Laboratories of Transducer Technology, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
  • 2Key Laboratory of Infrared Imaging Materials and Detectors, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
  • 3University of Chinese Academy of Sciences, Beijing 100049, China
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    Quan Sun, Defeng Mo, Dafu Liu, Haimei Gong. Research on the package structure of deep low-temperature and high-power resistor array[J]. Infrared and Laser Engineering, 2022, 51(8): 20210721

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    Paper Information

    Category: Optical devices

    Received: Oct. 8, 2021

    Accepted: --

    Published Online: Jan. 9, 2023

    The Author Email:

    DOI:10.3788/IRLA20210721

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