Infrared and Laser Engineering, Volume. 51, Issue 8, 20210721(2022)
Research on the package structure of deep low-temperature and high-power resistor array
Figures & Tables(11)
Fig. 2. Schematic diagram of (a) resistor array package structure, (b) distribution of temperature measurement points and (c) Ceramic heater structure
Fig. 3. Relationship between the temperature of the package structure and the thickness of the molybdenum (a) and copper (b) heat sink; Relationship between the thermal stress of the package structure and the thickness of the molybdenum (c) and copper (d) heat sink
Fig. 4. Diagrams between the temperature distribution of 1 mm (a), 2 mm (b) and 3 mm (c) molybdenum heat sink package structure and the thickness of the ceramic electrode plate; Diagrams between the thermal stress of 1 mm (d), 2 mm (e) and 3 mm (f) molybdenum heat sink package structure and the thickness of the ceramic electrode plate
Fig. 5. Diagram of temperature distribution of physical experiment and simulation analysis and heating power
Fig. 6. Temperature distribution diagram of ceramic heater model under 100 W heating power
Fig. 7. Diagram between the ratio of ceramic heater area which surface temperature is less than 130 K and the heating power
Fig. 8. Diagram between the heating time of 87.85-128.52 W heating power and the temperature of each temperature measurement point
Table 1. Comparison of package structure alternative material parameters （100 K）
View tableView in ArticleTable 1. Comparison of package structure alternative material parameters （100 K）
Materials λ/ W·(m·K)−1 α/ 10−6 E/ GPa μ Mo 174 2.69 320 0.3 Cu 483 16.7 140 0.34 Ceramic 4.5 6.7 360 0.26 304L 9.2 9.16 200 0.3 4J29 7.6 2.09 140 0.37 Si 124 2.49 112 0.28 Sapphire 27.2 8.40 345 0.29
Table 2. Relationship between the temperature of the main parts of the package structure and the material and thickness of the heat sink
View tableView in ArticleTable 2. Relationship between the temperature of the main parts of the package structure and the material and thickness of the heat sink
Material of heat sink Heat sink thickness/mm Temperature distribution/K Heat sink Ceramic Chip substrate Heater Mo 1 80.64 91.14 97.60 97.82 2 81.28 91.78 98.24 98.46 3 81.92 92.42 98.88 99.10 Cu 1 80.23 90.73 97.19 97.41 2 80.46 90.96 97.42 97.64 3 80.69 91.19 97.65 97.87
Table 3. Thermal resistance of different power at each temperature measurement point of ceramic heater
View tableView in ArticleTable 3. Thermal resistance of different power at each temperature measurement point of ceramic heater
Temperature measuring point Thermal resistance/K·W−1 0– 107.60 W 107.6– 192.72 W 192.72– 211.90 W Simulation results A 0.347 0.338 0.641 0.356 B 0.440 0.512 0.918 0.403 C 0.366 0.373 0.544 0.336
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Quan Sun, Defeng Mo, Dafu Liu, Haimei Gong. Research on the package structure of deep low-temperature and high-power resistor array[J]. Infrared and Laser Engineering, 2022, 51(8): 20210721
Paper Information
Category: Optical devices
Received: Oct. 8, 2021
Accepted: --
Published Online: Jan. 9, 2023
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