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Chinese Optics Letters, Volume. 16, Issue 1, 011404(2018)

Stress damage process of silicon wafer under millisecond laser irradiation

Zhichao Jia1, Tingzhong Zhang2, Huazhong Zhu1, Zewen Li1, Zhonghua Shen1, Jian Lu1, and Xiaowu Ni1、*
Author Affiliations
  • 1School of Science, Nanjing University of Science & Technology, Nanjing 210094, China
  • 2Institute of Mechanical and Electrical Engineering, Zhoukou Normal University, Zhoukou 466000, China
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    [2] Yangliang Li, Chao Shen, Li Shao, Yujun Zhang, "Dynamic image acquisition and particle recognition of laser-induced exit surface particle ejection in fused silica," Chin. Opt. Lett. 17, 101402 (2019)

    Cited By

    [1] Liping Peng, Yuan’an Zhao, Xiaofeng Liu, Yonggang Liu, Zhaoliang Cao, Meiping Zhu, Jianda Shao, Ruijin Hong, Chunxian Tao, Dawei Zhang. High-repetition-rate laser-induced damage of indium tin oxide films and polyimide films at a 1064 nm wavelength. Optical Materials Express, 9, 911(2019).

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    Zhichao Jia, Tingzhong Zhang, Huazhong Zhu, Zewen Li, Zhonghua Shen, Jian Lu, Xiaowu Ni, "Stress damage process of silicon wafer under millisecond laser irradiation," Chin. Opt. Lett. 16, 011404 (2018)

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    Paper Information

    Category: Lasers and Laser Optics

    Received: Sep. 12, 2017

    Accepted: Dec. 1, 2017

    Published Online: Jul. 17, 2018

    The Author Email: Xiaowu Ni (nxw@njust.edu.cn)

    DOI:10.3788/COL201816.011404

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology