Laser & Infrared, Volume. 54, Issue 4, 574(2024)

Fault diagnosis of TPA and IAOA-BILSTM circuit chips based on infrared

WANG Li, ZHU Meng*, and MA Jang-yan
Author Affiliations
  • Airborne Electronic Systems Deep Maintenance Laboratory, College of Vocational Technology, Civil Aviation University of China, Tianjin 300300, China
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    References(6)

    [4] [4] Dong Z, Chen L. Image registration in PCB fault detection based on infrared thermal imaging[C]//2019 Chinese Control Conference (CCC). IEEE, 2019: 4819-4823.

    [5] [5] El Belghiti Alaoui N, Tounsi P, Boyer A, et al. Detecting PCB assembly defects using infrared thermal signatures[C]//26th International Conference Mixed Design of Integrated Circuits and System (2019 MIXDES), 2019: 345.

    [11] [11] Mehra R. Thermal imaging-based fault diagnosis of electronics circuit boards[C]//Advances in Energy Technology: Select Proceedings of EMSME 2020. Springer Singapore, 2022: 111-121.

    [13] [13] Nacer S M, Nadia B, Abdelghani R, et al. A novel method for bearing fault diagnosis based on BiLSTM neural networks[J]. The International Journal of Advanced Manufacturing Technology, 2023: 1-16.

    [14] [14] SHIH S Y, SUN F K, LEE H. Temporal pattern attention for multivariate time series forecasting[J]. Machine Learning, 2019, 108(8): 1421-1441.

    [15] [15] Abusligah L, Diabat A, Mirjalili S, et al. The arithmetic optimization algorithm[J]. Computer Methods in Applied Mechanics and Engineering, 2021, 376: 113609.

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    WANG Li, ZHU Meng, MA Jang-yan. Fault diagnosis of TPA and IAOA-BILSTM circuit chips based on infrared[J]. Laser & Infrared, 2024, 54(4): 574

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    Paper Information

    Category:

    Received: Jun. 5, 2023

    Accepted: May. 21, 2025

    Published Online: May. 21, 2025

    The Author Email: ZHU Meng (1935427533@qq.com)

    DOI:10.3969/j.issn.1001-5078.2024.04.014

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