Acta Optica Sinica, Volume. 44, Issue 15, 1513015(2024)

Technologies and Challenges of Large-Scale Silicon Photonic Integrated Circuit (Invited)

Yu Li, Qiang Li, Dapeng Liu, Junbo Feng*, and Jin Guo
Author Affiliations
  • United Microelectronics Center (CUMEC), Chongqing 401332, China
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    [12] Camenzind H[M]. Designing analog chips(2005).

    [21] Jin J M[M]. The finite element method in electromagnetics(2015).

    [39] Ou X P, Yang Z L, Tang B et al. Silicon photonic 2.5D/3D integration technology and its applications[J]. Study on Optical Communications, 1-16(2023).

    [67] Wei Y Y[M]. Advanced lithography theory and application of ultra large scale integrated circuits(2016).

    [134] Sun H. Defect modes in copper interconnect process and their impact on integrated circuit yield[D](2009).

    [138] Selvaraja S K. Wafer-scale fabrication technology for silicon photonic integrated circuits[D](2011).

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    Yu Li, Qiang Li, Dapeng Liu, Junbo Feng, Jin Guo. Technologies and Challenges of Large-Scale Silicon Photonic Integrated Circuit (Invited)[J]. Acta Optica Sinica, 2024, 44(15): 1513015

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    Paper Information

    Category: Integrated Optics

    Received: Apr. 29, 2024

    Accepted: Jun. 6, 2024

    Published Online: Jul. 31, 2024

    The Author Email: Feng Junbo (junbo.feng@cumec.cn)

    DOI:10.3788/AOS240946

    CSTR:32393.14.AOS240946

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