Acta Optica Sinica, Volume. 44, Issue 21, 2112002(2024)

Reconstruction Method of Wafer Map Based on Parametric Surface

Zhipeng Wu1,2, Yuejing Qi1,2、*, Dan Wang1,2, Tianwei Xu1, and Xin Zhou1,2
Author Affiliations
  • 1Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China
  • 2University of Chinese Academy of Sciences, Beijing 100049, China
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    Figures & Tables(11)
    Schematic diagram of level sensor
    Schematic diagram of measurement spots
    Sampling and fitting areas of height map and wafer map. (a) Height sampling areas; (b) fitting areas of wafer map
    Schematic diagram of focus error
    Experimental platform of lithography and focus control. (a) Level sensor and base frame; (b) wafer stage and interferometer
    Height map measured by level sensor. (a) Full wafer; (b) center Die
    Wafer map of static exposure. (a) Full wafer; (b) center Die
    Wafer stage motion trajectories of static exposure. (a) Z-axis; (b) Rx-axis; (c) Ry-axis; (d) center Die
    Reconstruction results of parametric wafer map. (a) Full wafer; (b) center Die
    Wafer stage motion trajectories based on parametric surface. (a) Z-axis; (b) Rx-axis; (c) Ry-axis; (d) center Die
    Evaluation results of full wafer focus error. (a) MAFEdie; (b) MSDFEdie
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    Zhipeng Wu, Yuejing Qi, Dan Wang, Tianwei Xu, Xin Zhou. Reconstruction Method of Wafer Map Based on Parametric Surface[J]. Acta Optica Sinica, 2024, 44(21): 2112002

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    Paper Information

    Category: Instrumentation, Measurement and Metrology

    Received: May. 15, 2024

    Accepted: Jul. 15, 2024

    Published Online: Nov. 18, 2024

    The Author Email: Qi Yuejing (Qiyuejing@ime.ac.cn)

    DOI:10.3788/AOS241018

    CSTR:32393.14.AOS241018

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