Researching | Multi‐Channel Infrared Medium Long Wave Chip and Dual‐Lens Integrated Component Packaging Technology

Acta Optica Sinica, Volume. 44, Issue 18, 1828002(2024)

Multi‐Channel Infrared Medium Long Wave Chip and Dual‐Lens Integrated Component Packaging Technology

Haiyong Zhu, Peng Ji, Zhijiang Zeng, Qinfei Xu^*, Junlin Chen, Jinglin Zhang, Lin Xu, and Xue Li

Author Affiliations

State Key Laboratory of Transducer Technology, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China

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Haiyong Zhu, Peng Ji, Zhijiang Zeng, Qinfei Xu, Junlin Chen, Jinglin Zhang, Lin Xu, Xue Li. Multi‐Channel Infrared Medium Long Wave Chip and Dual‐Lens Integrated Component Packaging Technology[J]. Acta Optica Sinica, 2024, 44(18): 1828002

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Paper Information

Category: Remote Sensing and Sensors

Received: Dec. 29, 2023

Accepted: Feb. 2, 2024

Published Online: Sep. 11, 2024

The Author Email: Xu Qinfei (xu5178@163.com)

DOI:10.3788/AOS232011

CSTR:32393.14.AOS232011

Topics

laser devices and laser physics

Lasers and Laser Optics

laser manufacturing

Instrumentation, Measurement and Metrology