Multi‐Channel Infrared Medium Long Wave Chip and Dual‐Lens Integrated Component Packaging Technology

Haiyong Zhu; Peng Ji; Zhijiang Zeng; Qinfei Xu; Junlin Chen; Jinglin Zhang; Lin Xu; Xue Li

doi:10.3788/AOS232011

Acta Optica Sinica, Volume. 44, Issue 18, 1828002(2024)

Multi‐Channel Infrared Medium Long Wave Chip and Dual‐Lens Integrated Component Packaging Technology

Haiyong Zhu, Peng Ji, Zhijiang Zeng, Qinfei Xu^*, Junlin Chen, Jinglin Zhang, Lin Xu, and Xue Li

State Key Laboratory of Transducer Technology, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China

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Figures & Tables(13)

Fig. 1. Arrangement and dimensional schematic of photo-sensitive unit

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Fig. 2. Component structure design

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Fig. 3. Filter support deformation curve

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Fig. 4. Spectral and quantitative spectral curves of components at low temperature (88 K).(a) Spectral curves; (b) quantitative spectral curves

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Fig. 5. Deformation of inner surface of lens 1 under pressure and and at low temperature. (a) Under pressure; (b) at low temperature

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Fig. 6. Deformation curves of lens 1 surface center varying with component pressure. (a) Outer surface; (b) inner surface

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Fig. 7. Component stray light analysis.(a) Stray light ratio of key planes in band of 5.80-6.70 μm; (b) stray light ratio of key planes in band of 6.75-7.15 μm; (c) stray light ratio of key planes in band of 7.24-7.60 μm; (d) total radiated stray light of key planes in three bands

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Fig. 8. Signal and noise maps before and after environmental tests

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Fig. 9. Component application for taking cloud images

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Table 1. Variation of system MTF values of three fields at Nyquist frequency

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Table 1. Variation of system MTF values of three fields at Nyquist frequency

Condition	Axial field of view		0.7 field of view		Full field of view
Condition	Meridian	Sagittal	Meridian	Sagittal	Meridian	Sagittal
Original	0.7223	0.7223	0.7106	0.7197	0.7108	0.7126
Condition 1	0.7206	0.7104	0.7003	0.7165	0.6992	0.6997
Condition 2	0.7211	0.7115	0.7001	0.7174	0.6989	0.6991

Table 2. Variation of wavefront error RMS of center wavelength based on deformation effect
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Table 2. Variation of wavefront error RMS of center wavelength based on deformation effect
Condition Axial field of view 0.7 field of view Full field of view
Without deformation /λ 0.0192 0.0367 0.0256
Condition 1 /λ 0.0203 0.0375 0.0273
Condition 2 /λ 0.0201 0.0379 0.0276

Table 3. Test conditions of vibration

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Table 3. Test conditions of vibration

Identification level and sinusoidal vibration in X， Y， and Z directions			Identification level and random vibration in X， Y， and Z directions
Scan rate /（oct/min）	2		Total RMS acceleration	6
Frequency range /Hz	5-20	12-100	Frequency range /Hz	20-80	80-350	50-2000
Vibration level （0-P） /g	0.27	9.67	Acceleration power density	3 dB/oct	0.05 g²/Hz	3 dB/oct

Table 4. Main performance indexes of infrared focal plane array (IRFPA)

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Table 4. Main performance indexes of infrared focal plane array (IRFPA)

Item	Value	Item	Value
Areal array structure	3×4	Noise /μV	≤2.2
Wave band /μm	5.80-6.70 6.75-7.15 7.24-7.60	Temperature /K	85
Photosensitive element size /（mm×mm）	0.056×0.056	Response heterogeneity	<10%
Center distance between adjacent photosensitive elements in channel /mm	0.784±0.005	Weight /g	<65
Band detection rate D_p* /（cm·Hz^1/2·W^-1）	>7×10¹⁰ （85 K）	Crosstalk	<4%

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Haiyong Zhu, Peng Ji, Zhijiang Zeng, Qinfei Xu, Junlin Chen, Jinglin Zhang, Lin Xu, Xue Li. Multi‐Channel Infrared Medium Long Wave Chip and Dual‐Lens Integrated Component Packaging Technology[J]. Acta Optica Sinica, 2024, 44(18): 1828002

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