Electronics and Packaging, Volume. 25, Issue 7, 70102(2025)

Research Progress of Glass-Based Bonding Technology

FU Juefeng1,2, CHEN Hongwei1,2, LIU Jinxu1,2, and ZHANG Jihua1,2、*
Author Affiliations
  • 1School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China
  • 2State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
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    FU Juefeng, CHEN Hongwei, LIU Jinxu, ZHANG Jihua. Research Progress of Glass-Based Bonding Technology[J]. Electronics and Packaging, 2025, 25(7): 70102

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    Paper Information

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    Received: Mar. 10, 2025

    Accepted: Aug. 26, 2025

    Published Online: Aug. 26, 2025

    The Author Email: ZHANG Jihua (jhzhang@uestc.edu.cn)

    DOI:10.16257/j.cnki.1681-1070.2025.0139

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