Research Progress of Glass-Based Bonding Technology

FU Juefeng; CHEN Hongwei; LIU Jinxu; ZHANG Jihua

doi:10.16257/j.cnki.1681-1070.2025.0139

Electronics and Packaging, Volume. 25, Issue 7, 70102(2025)

Research Progress of Glass-Based Bonding Technology

FU Juefeng^1,2, CHEN Hongwei^1,2, LIU Jinxu^1,2, and ZHANG Jihua^1,2、*

¹School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China

²State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China

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FU Juefeng, CHEN Hongwei, LIU Jinxu, ZHANG Jihua. Research Progress of Glass-Based Bonding Technology[J]. Electronics and Packaging, 2025, 25(7): 70102

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Received: Mar. 10, 2025

Accepted: Aug. 26, 2025

Published Online: Aug. 26, 2025

The Author Email: ZHANG Jihua (jhzhang@uestc.edu.cn)

DOI:10.16257/j.cnki.1681-1070.2025.0139

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