Opportunities and Challenges of Optoelectronic Co-Packaging Technology in the Era of Big Data

Lingyan Bian; Yanping Zeng; Ying Cai; Xiao Lu; Qianrong Zhou; Qinglin Tang; Tingwei Gu; Lu Wang

doi:10.3788/LOP231348

Laser & Optoelectronics Progress, Volume. 61, Issue 9, 0900006(2024)

Opportunities and Challenges of Optoelectronic Co-Packaging Technology in the Era of Big Data

Lingyan Bian^*, Yanping Zeng^**, Ying Cai, Xiao Lu, Qianrong Zhou, Qinglin Tang, Tingwei Gu, and Lu Wang

Author Affiliations

China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 214072, Jiangsu, China

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Lingyan Bian, Yanping Zeng, Ying Cai, Xiao Lu, Qianrong Zhou, Qinglin Tang, Tingwei Gu, Lu Wang. Opportunities and Challenges of Optoelectronic Co-Packaging Technology in the Era of Big Data[J]. Laser & Optoelectronics Progress, 2024, 61(9): 0900006

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Paper Information

Category: Reviews

Received: May. 22, 2023

Accepted: Jun. 20, 2023

Published Online: May. 10, 2024

The Author Email: Lingyan Bian (bianlingyan1123@163.com), Yanping Zeng (zyanping123@163.com)

DOI:10.3788/LOP231348

CSTR:32186.14.LOP231348

Topics

laser devices and laser physics

Lasers and Laser Optics

Laser physics

laser manufacturing

Instrumentation, Measurement and Metrology