Journal of Inorganic Materials, Volume. 40, Issue 5, 536(2025)
The lithium-based silicate microwave dielectric ceramics with ultra-low permittivity show great potential as substrate materials in the fifth-generation wireless communication technology. However, the residual stress caused by higher sintering temperatures leads to increased dielectric loss, thereby deteriorating the microwave dielectric performance. In this work, B3+ was introduced into LiAlSi2O6 ceramics to reduce Al3+ content, aiming to improve their sintering temperature and microwave dielectric performance. LiBxAl1-xSi2O6 (0≤x≤0.20) microwave dielectric ceramics were prepared using a combination of solid-state reaction and cold isostatic pressing techniques. Effects of B3+ doping on the sintering characteristics, phase structure, microstructure, and microwave dielectric properties of the materials were characterized. The results show that with a gradual increase in the doping concentration, sintering temperature of the ceramics decreases significantly from 1400 to 1000 ℃. Meanwhile, the relative permittivity (εr) decreases from 3.95 to 3.69, the quality factor (Q×f) increases significantly from 24300 to 30560 GHz, and the temperature coefficient of resonant frequency (τf) increases from -45.9×10-6 to -20.9×10-6 ℃-1. Specifically, the change in εr is mainly influenced by intrinsic polarization, lattice vibrations, and covalent bond strength of the material; the improvement in Q×f is closely related to the increase in packing fraction (PF) and the decrease in damping coefficient; the increase in τf is strongly correlated with the bond valence of oxygen (VO). Furthermore, the composition with x = 0.20 exhibits the best microwave dielectric performance with εr = 3.69, Q×f = 30560 GHz, and τf = -20.9×10-6 ℃-1. Findings of this study on LiBxAl1-xSi2O6 provide important theoretical guidance and practical insights for development and application of high-performance microwave dielectric ceramics in the future.
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Siyu XIONG, Chen MO, Xiaowei ZHU, Guobin ZHU, Deqin CHEN, Laijun LIU, Xiaodong SHI, Chunchun LI.
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Received: Nov. 27, 2024
Accepted: --
Published Online: Sep. 2, 2025
The Author Email: Chunchun LI (lichunchun2003@126.com)