This study investigates the photolithography process for surface acoustic wave filters. By employing double-patterning technology, high-density and complex chip patterns are decomposed into two separate, low-density and simplified patterns. Through dual-exposure technology, two sets of interdigitated electrodes with significant duty ratio differences are sequentially exposed onto the same layer of photoresist. This method reduces the complexity of the photolithography process while enhancing the photolithographic quality of the chip patterns. Notably, the performance of the fabricated chips aligns with simulation results.