Semiconductor Optoelectronics, Volume. 46, Issue 4, 693(2025)
Simulation of Through-Silicon Via Design and Characteristics for High-Speed Optoelectronic Three-Dimensional Integration
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XIE Han, WANG Pan, TIAN Sijie. Simulation of Through-Silicon Via Design and Characteristics for High-Speed Optoelectronic Three-Dimensional Integration[J]. Semiconductor Optoelectronics, 2025, 46(4): 693
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Received: Jul. 20, 2025
Accepted: Sep. 18, 2025
Published Online: Sep. 18, 2025
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