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Microelectronics, Volume. 54, Issue 1, 165(2024)

A Failure Mechanism and Its Optimization Method for Flip-Chip Package Micropore

CHEN Zhaohui1, ZHANG Chi1, XU Peng1, ZENG Wei2, WU Jiajin2, SU Wei2, CHEN Songjiao2, and WANG Qiang2
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    CHEN Zhaohui, ZHANG Chi, XU Peng, ZENG Wei, WU Jiajin, SU Wei, CHEN Songjiao, WANG Qiang. A Failure Mechanism and Its Optimization Method for Flip-Chip Package Micropore[J]. Microelectronics, 2024, 54(1): 165

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    Received: Sep. 4, 2023

    Accepted: --

    Published Online: Aug. 7, 2024

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.230344

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology