Electronics and Packaging, Volume. 25, Issue 7, 70201(2025)
CBGA Solder Joint Life Prediction Technology Based on Test and Simulation
[3] [3] LIM N R E G, UBANDO A T, GONZAGA J A, et al. Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading[J]. Engineering Failure Analysis, 2020, 116: 104717.
[4] [4] XIE D J, ZHANG A, SHIRANGI H, et al. Duplicable and effective: a new drop test for BGA assemblies[C]//2015 IEEE 65th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2015: 417-424.
[5] [5] MAO M H, WANG W W, LU C H, et al. Machine learning for board-level drop response of BGA packaging structure[J]. Microelectronics Reliability, 2022, 134: 114553.
[6] [6] LIU F, MENG G, ZHAO M, et al. Experimental and numerical analysis of BGA lead-free solder joint reliability under board-level drop impact[J]. Microelectronics Reliability, 2009, 49(1): 79-85.
[7] [7] SYED M M S M Z, ANI F C, RAMLI M R, et al. Effect of moisture content on crack formation during reflow soldering of ball grid array (BGA) component[C]//Advances in Robotics, Automation and Data Analytics. Cham: Springer International Publishing, 2021: 309-314.
[8] [8] WANG J, NIU Y L, SHAO S, et al. A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow[J]. Microelectronics Reliability, 2020, 112: 113791.
[9] [9] HENG E, ABDULLAH M Z. Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflow[J]. Soldering & Surface Mount Technology, 2022, 34(2): 103-115.
[13] [13] NOURANI A, AKBARI S, SPELT J K. Fracture load prediction of BGA solder joints: cohesive zone modeling and experimental verification[J]. International Journal of Solids and Structures, 2016, 90: 30-44.
[14] [14] KIM J W, JUNG S B. Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints[J]. Materials Science and Engineering: A, 2004, 371(1/2): 267-276.
[15] [15] HU W, LI Y, SUN Y, et al. A model of BGA thermal fatigue life prediction considering load sequence effects[J]. Materials (Basel), 2016, 9(10): E860.
[16] [16] LUO X B, MAO Z M, LIU J, et al. An analytical thermal resistance model for calculating mean die temperature of a typical BGA packaging[J]. Thermochimica Acta, 2011, 512(1/2): 208-216.
[19] [19] LIU F, LU Y, WANG Z, et al. Numerical simulation and fatigue life estimation of BGA packages under random vibration loading[J]. Microelectronics Reliability, 2015, 55(12): 2777-2785.
[20] [20] JIANG T B, DU C, XU L H. Finite element analysis and fatigue life prediction of BGA mixed solder joints[C]//High Density Design Packaging and Microsystem Integration, 2007 International Symposium on, 2007: 1-6.
Get Citation
Copy Citation Text
LI Jie, CAO Shibo, YU Wei, LI Zeyuan, QIAO Zhizhuang, LIU Linjie, ZHANG Zhaofu, LIU Sheng, GUO Yuzheng. CBGA Solder Joint Life Prediction Technology Based on Test and Simulation[J]. Electronics and Packaging, 2025, 25(7): 70201
Category:
Received: Dec. 19, 2024
Accepted: Aug. 26, 2025
Published Online: Aug. 26, 2025
The Author Email: LIU Sheng (shengliu@whu.edu.cn)