Electronics and Packaging, Volume. 25, Issue 7, 70201(2025)

CBGA Solder Joint Life Prediction Technology Based on Test and Simulation

LI Jie1,2, CAO Shibo2, YU Wei1, LI Zeyuan1, QIAO Zhizhuang2, LIU Linjie2, ZHANG Zhaofu3, LIU Sheng1,3、*, and GUO Yuzheng1,3,4
Author Affiliations
  • 1School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China
  • 2China Electronics Technology Group Corporation No.13 Research Institute, Shijiazhuang 050051, China
  • 3The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China
  • 4School of Electrical Engineering and Automation, Wuhan University, Wuhan 430072, China
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    References(13)

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    [7] [7] SYED M M S M Z, ANI F C, RAMLI M R, et al. Effect of moisture content on crack formation during reflow soldering of ball grid array (BGA) component[C]//Advances in Robotics, Automation and Data Analytics. Cham: Springer International Publishing, 2021: 309-314.

    [8] [8] WANG J, NIU Y L, SHAO S, et al. A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow[J]. Microelectronics Reliability, 2020, 112: 113791.

    [9] [9] HENG E, ABDULLAH M Z. Influence of moisture concentration and hydrophobic material on induced stress in FCBGA package under reflow[J]. Soldering & Surface Mount Technology, 2022, 34(2): 103-115.

    [13] [13] NOURANI A, AKBARI S, SPELT J K. Fracture load prediction of BGA solder joints: cohesive zone modeling and experimental verification[J]. International Journal of Solids and Structures, 2016, 90: 30-44.

    [14] [14] KIM J W, JUNG S B. Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints[J]. Materials Science and Engineering: A, 2004, 371(1/2): 267-276.

    [15] [15] HU W, LI Y, SUN Y, et al. A model of BGA thermal fatigue life prediction considering load sequence effects[J]. Materials (Basel), 2016, 9(10): E860.

    [16] [16] LUO X B, MAO Z M, LIU J, et al. An analytical thermal resistance model for calculating mean die temperature of a typical BGA packaging[J]. Thermochimica Acta, 2011, 512(1/2): 208-216.

    [19] [19] LIU F, LU Y, WANG Z, et al. Numerical simulation and fatigue life estimation of BGA packages under random vibration loading[J]. Microelectronics Reliability, 2015, 55(12): 2777-2785.

    [20] [20] JIANG T B, DU C, XU L H. Finite element analysis and fatigue life prediction of BGA mixed solder joints[C]//High Density Design Packaging and Microsystem Integration, 2007 International Symposium on, 2007: 1-6.

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    LI Jie, CAO Shibo, YU Wei, LI Zeyuan, QIAO Zhizhuang, LIU Linjie, ZHANG Zhaofu, LIU Sheng, GUO Yuzheng. CBGA Solder Joint Life Prediction Technology Based on Test and Simulation[J]. Electronics and Packaging, 2025, 25(7): 70201

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    Paper Information

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    Received: Dec. 19, 2024

    Accepted: Aug. 26, 2025

    Published Online: Aug. 26, 2025

    The Author Email: LIU Sheng (shengliu@whu.edu.cn)

    DOI:10.16257/j.cnki.1681-1070.2025.0153

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