CBGA Solder Joint Life Prediction Technology Based on Test and Simulation

LI Jie; CAO Shibo; YU Wei; LI Zeyuan; QIAO Zhizhuang; LIU Linjie; ZHANG Zhaofu; LIU Sheng; GUO Yuzheng

doi:10.16257/j.cnki.1681-1070.2025.0153

Electronics and Packaging, Volume. 25, Issue 7, 70201(2025)

CBGA Solder Joint Life Prediction Technology Based on Test and Simulation

LI Jie^1,2, CAO Shibo², YU Wei¹, LI Zeyuan¹, QIAO Zhizhuang², LIU Linjie², ZHANG Zhaofu³, LIU Sheng^1,3、*, and GUO Yuzheng^1,3,4

Author Affiliations

¹School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, China

²China Electronics Technology Group Corporation No.13 Research Institute, Shijiazhuang 050051, China

³The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China

⁴School of Electrical Engineering and Automation, Wuhan University, Wuhan 430072, China

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LI Jie, CAO Shibo, YU Wei, LI Zeyuan, QIAO Zhizhuang, LIU Linjie, ZHANG Zhaofu, LIU Sheng, GUO Yuzheng. CBGA Solder Joint Life Prediction Technology Based on Test and Simulation[J]. Electronics and Packaging, 2025, 25(7): 70201

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Paper Information

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Received: Dec. 19, 2024

Accepted: Aug. 26, 2025

Published Online: Aug. 26, 2025

The Author Email: LIU Sheng (shengliu@whu.edu.cn)

DOI:10.16257/j.cnki.1681-1070.2025.0153

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