Recent Progress in Electroless Plating Process for Metallization of Through Glass Via

SUN Peng; ZHONG Yi; YU Daquan

doi:10.16257/j.cnki.1681-1070.2025.0158

Electronics and Packaging, Volume. 25, Issue 7, 70107(2025)

Recent Progress in Electroless Plating Process for Metallization of Through Glass Via

SUN Peng¹, ZHONG Yi^2、*, and YU Daquan^2,3

Author Affiliations

¹College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, China

²School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China

³Xiamen Sky Semiconductor Technology Co., Ltd., Xiamen 361013, China

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SUN Peng, ZHONG Yi, YU Daquan. Recent Progress in Electroless Plating Process for Metallization of Through Glass Via[J]. Electronics and Packaging, 2025, 25(7): 70107

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Paper Information

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Received: May. 2, 2025

Accepted: Aug. 26, 2025

Published Online: Aug. 26, 2025

The Author Email: ZHONG Yi (zhongyi@xmu.edu.cn)

DOI:10.16257/j.cnki.1681-1070.2025.0158

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