High Power Laser and Particle Beams, Volume. 35, Issue 5, 051001(2023)
Study of packaging in master oscillator power amplifier diode laser chip
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Pengfei Xie, Jun Lei, Yonggang Zhang, Chengqian Wang, Wenqiang Lü, Zhao Wang, Weichuan Du, Songxin Gao. Study of packaging in master oscillator power amplifier diode laser chip[J]. High Power Laser and Particle Beams, 2023, 35(5): 051001
Category: High Power Laser Physics and Technology
Received: Jul. 27, 2022
Accepted: Feb. 22, 2023
Published Online: May. 6, 2023
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