Journal of Semiconductors, Volume. 45, Issue 7, 072303(2024)

Dual-phase coexistence enables to alleviate resistance drift in phase-change films

Tong Wu1, Chen Chen1, Jinyi Zhu1, Guoxiang Wang1,2、*, and Shixun Dai1,2
Author Affiliations
  • 1Laboratory of Infrared Materials and Devices, The Research Institute of Advanced Technologies, Ningbo University, Ningbo 315211, China
  • 2Institute of Ocean Engineering, Ningbo University, Ningbo 315211, China
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    Figures & Tables(4)
    (Color online) (a) Relationship between sheet resistance and annealing temperature at heating rate of 30 °C/min. (b) Plot of failure time versus reciprocal temperature and (c) sheet resistance as a function of time for SnS-doped GST films at 50 °C for up to 103 s.
    (Color online) (a) Plot of (αhν)1/2 vs. hν for pure GST and SnS-doped GST samples. (b) Relationship between electrical conductivity and the reciprocal temperature for amorphous GST and SnS-doped GST films.
    (Color online) X-ray diffraction patterns of as-deposited and annealed (a) (SnS)8.8(GST)91.2, (b) (SnS)35.1(GST)64.9, and (c) (SnS)54.6(GST)45.4 films.
    (Color online) Raman scattering spectra of as-deposited and annealed (a) pure SnS, (b) (SnS)8.8(GST)91.2, (c) (SnS)35.1(GST)64.9, and (d) (SnS)54.6(GST)45.4, respectively.
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    Tong Wu, Chen Chen, Jinyi Zhu, Guoxiang Wang, Shixun Dai. Dual-phase coexistence enables to alleviate resistance drift in phase-change films[J]. Journal of Semiconductors, 2024, 45(7): 072303

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    Paper Information

    Category: Articles

    Received: Apr. 9, 2024

    Accepted: --

    Published Online: Jul. 18, 2024

    The Author Email: Guoxiang Wang (GXWang)

    DOI:10.1088/1674-4926/24040013

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