Photonics Research, Volume. 10, Issue 8, 1964(2022)
Ultrafast miniaturized GaN-based optoelectronic proximity sensor
Fig. 1. (a) Schematic diagrams showing the fabrication process flow of the GaN chip. (b) Optical image of the packaged chip; inset shows the enlarged image of the chip. Scale bar is 500 μm. (c) Schematic diagram depicting the operating principle of the proximity sensor.
Fig. 2. (a)
Fig. 3. (a) Transient response of the sensor. The emitter is biased with square waves with high voltage levels of 2.8 V, 3.0 V, and 3.2 V. (b) Optical image of the experimental setup used to measure the dynamic response of the sensor. The inset shows a close-up image. (c) Dynamic response measured from an Al foil moving back and forth repeatedly at different distances from the surface of the sensor. Inset shows the schematic of experimental measurement. (d) Measured photocurrent under one cyclic movement of Al foil between
Fig. 4. Sensor for real-time monitoring. Optical images of the sensor mounted on (a) volunteer’s neck, and close to (b) mechanical pump, (c) speaker diaphragm; (d)–(f) photocurrent profiles measured from the corresponding conditions in (a)–(c); the driving current of the emitter is fixed at 10 mA.
Fig. 5. (a) Optical image of the sensor mounted close to rotating disk half-painted in black and white; (b) photocurrent profiles measured from the disk at different rotating speeds when the emitter current is 10 mA.
Fig. 6. (a) Optical images showing the selective area coverage of the Al foils on the sensor using the micropositioners; distributions of photocurrent changes of units acting as receivers when Al foil is overlaid on (b)–(d) single, (e), (f) double, and (g) triple units. The emitter operates at a low current of 1 mA.
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Xiaoshuai An, Hongying Yang, Yumeng Luo, Zhiqin Chu, Kwai Hei Li, "Ultrafast miniaturized GaN-based optoelectronic proximity sensor," Photonics Res. 10, 1964 (2022)
Category: Instrumentation and Measurements
Received: May. 5, 2022
Accepted: Jun. 28, 2022
Published Online: Jul. 27, 2022
The Author Email: Zhiqin Chu (zqchu@eee.hku.hk), Kwai Hei Li (khli@sustech.edu.cn)