Chinese Journal of Lasers, Volume. 48, Issue 1, 0113001(2021)

Fabrication of Flexible Surface-Enhanced Raman Spectroscopy Chip

Feng Yang1,2,3, Ping Wen1,2,3, Zhiqiang Zhang1,2, Danyang Li1,2, Li Chen1,2、*, Shunbo Li1, and Yi Xu1
Author Affiliations
  • 1Key Laboratory of Optoelectronic Technology and Systems, Ministry of Education, College of Optoelectronic Engineering, Chongqing University, Chongqing 400044, China
  • 2State Key Laboratory of Transducer Technology, Chinese Academy of Sciences, Shanghai 200050, China
  • 3School of Intelligent Manufacturing, Sichuan University of Arts and Science, Dazhou, Sichuan 635000, China
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    Figures & Tables(4)
    Characterization results of Ag nanoparticles. (a) Ultraviolet-visible spectrum, inset is FESEM image; (b) diameter distribution of Ag nanoparticles
    Influence of substrates on Raman signals. (a) Principle diagram of collecting Raman light; (b) light energy distribution with different reflectivity; (c) light energy density curves with different reflectivity; (d) relative reflectivity of different substrates; (e) peak values of different substrates at Raman displacement is 1360cm-1; (f) normalized curves of simulation result and experimental result
    Preparation of SERS chip. (a) Microscopic images of Ag sol containing different proportions of ethylene glycol after drying; (b) picture of array detection area and silver sol droplets; (c) distribution of Ag nanoparticles in detection area
    SERS chip performance test results. (a) SERS of different concentrations of R6G solution; (b) SERS mapping of SERS chip; (c) bending SERS chip; (d) SERS mapping of chip after bending for many times
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    Feng Yang, Ping Wen, Zhiqiang Zhang, Danyang Li, Li Chen, Shunbo Li, Yi Xu. Fabrication of Flexible Surface-Enhanced Raman Spectroscopy Chip[J]. Chinese Journal of Lasers, 2021, 48(1): 0113001

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    Paper Information

    Category: micro and nano optics

    Received: Jul. 21, 2020

    Accepted: Aug. 21, 2020

    Published Online: Jan. 13, 2021

    The Author Email: Chen Li (CL2009@cqu.edu.cn)

    DOI:10.3788/CJL202148.0113001

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