AEROSPACE SHANGHAI, Volume. 42, Issue 4, 66(2025)
Research on 3D CT Non-destructive Testing Methods for Advanced Packaging of Microsystems
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Lin DU, Yan JIANG, Zebin KONG, Bo WANG, Minwei ZHU, Lanlai WANG, Kunshu WANG. Research on 3D CT Non-destructive Testing Methods for Advanced Packaging of Microsystems[J]. AEROSPACE SHANGHAI, 2025, 42(4): 66
Category: Microsystems Devices and Reliable Applications
Received: Jun. 9, 2025
Accepted: --
Published Online: Sep. 29, 2025
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