AEROSPACE SHANGHAI, Volume. 42, Issue 4, 66(2025)
Research on 3D CT Non-destructive Testing Methods for Advanced Packaging of Microsystems
Fig. 2. Conceptual image of the 2.5D microsystem based on silicon interposer
Fig. 3. Warpage measurement techniques given in the JESD22 standard
Fig. 4. Picture of the 2.5D interposer for the advanced packaging integrated chip of microsystems
Fig. 10. 2D CT slice images of the interposer at different locations
Fig. 11. Images of the bright and dark points of the highlighted areas in the figure after quantification
Fig. 13. Measurement and characterization for the TSV copper convex
Fig. 14. Welding quality characterization of resistance on the silicon interposer
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Lin DU, Yan JIANG, Zebin KONG, Bo WANG, Minwei ZHU, Lanlai WANG, Kunshu WANG. Research on 3D CT Non-destructive Testing Methods for Advanced Packaging of Microsystems[J]. AEROSPACE SHANGHAI, 2025, 42(4): 66
Category: Microsystems Devices and Reliable Applications
Received: Jun. 9, 2025
Accepted: --
Published Online: Sep. 29, 2025
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