AEROSPACE SHANGHAI, Volume. 42, Issue 4, 66(2025)

Research on 3D CT Non-destructive Testing Methods for Advanced Packaging of Microsystems

Lin DU1, Yan JIANG2, Zebin KONG1, Bo WANG1, Minwei ZHU1, Lanlai WANG1, and Kunshu WANG1、*
Author Affiliations
  • 1Shanghai Institute of Aerospace Technology and Basic Research,Shanghai201109,China
  • 2Shanghai Aerospace Control Technology Institute,Shanghai201109,China
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    Figures & Tables(14)
    Main forms of microsystem packaging evolution
    Conceptual image of the 2.5D microsystem based on silicon interposer
    Warpage measurement techniques given in the JESD22 standard
    Picture of the 2.5D interposer for the advanced packaging integrated chip of microsystems
    Principle diagram of 2D CT detection
    Principle diagram of 3D CT detection
    Picture of sample testing
    3D CT photos of the interposer
    2D CT slices of the interposer without warping
    2D CT slice images of the interposer at different locations
    Images of the bright and dark points of the highlighted areas in the figure after quantification
    TSV size characterization
    Measurement and characterization for the TSV copper convex
    Welding quality characterization of resistance on the silicon interposer
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    Lin DU, Yan JIANG, Zebin KONG, Bo WANG, Minwei ZHU, Lanlai WANG, Kunshu WANG. Research on 3D CT Non-destructive Testing Methods for Advanced Packaging of Microsystems[J]. AEROSPACE SHANGHAI, 2025, 42(4): 66

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    Paper Information

    Category: Microsystems Devices and Reliable Applications

    Received: Jun. 9, 2025

    Accepted: --

    Published Online: Sep. 29, 2025

    The Author Email:

    DOI:10.19328/j.cnki.2096-8655.2025.04.007

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