The evolution trend of advanced packaging architectures for microsystem devices is analyzed，and the reliability issues and risks of the most widely used 2.5D advanced packaging structure for microsystems are summarized.In view of the difficulties in detecting typical risks of high-value microsystem devices，the non-destructive testing methods are studied.The experiment adopts a 3D micro computed tomography （CT） method，and the characteristics of 2.5D advanced microsystem packaging are analyzed based on a nano-microfocus X-ray tube.For the first time，a contour analysis method based on 2D solder ball virtual slice data is proposed，and the analysis accuracy of the micro-warpage of the interposer reaches 1 μm.The 3D non-destructive testing accuracy of the fine size of the internal through silicon via （TSV） is verified by comparing the TSV 2D slice data with the scanning electron micro-scope sample data.The copper convex morphology in the interposer is confirmed by the analysis on the experimental data of the interposer.The measured data are displayed，which characterize the quality of the micro-solder joints of the resistor welding on the interposer.This paper provides a new evaluation method for the reliability evaluation of advanced microsystem packaging.The experimental data confirm the effectiveness of the method，and provide a reference for the defect identification.