Chinese Optics Letters, Volume. 8, Issue 10, 1000(2010)

Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser

Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, and Liang Zhang
Author Affiliations
  • Department of Applied Physics, Nanjing University of Science &
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    CLP Journals

    [1] Jia Li, Liming Dong, Chenyin Ni, Zhonghua Shen, Hongchao Zhang, "Application of ultrasonic surface waves in the detection of microcracks using the scanning heating laser source technique," Chin. Opt. Lett. 10, 111403 (2012)

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    Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, Liang Zhang, "Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser," Chin. Opt. Lett. 8, 1000 (2010)

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    Paper Information

    Received: Mar. 23, 2010

    Accepted: --

    Published Online: Oct. 19, 2010

    The Author Email:

    DOI:10.3788/COL20100810.1000

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