Chinese Optics Letters, Volume. 8, Issue 10, 1000(2010)
Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser
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Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, Liang Zhang, "Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser," Chin. Opt. Lett. 8, 1000 (2010)
Received: Mar. 23, 2010
Accepted: --
Published Online: Oct. 19, 2010
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