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Chinese Optics Letters, Volume. 8, Issue 10, 1000(2010)

Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser

Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, and Liang Zhang
Author Affiliations
  • Department of Applied Physics, Nanjing University of Science &
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    The article is cited by 6 article(s) from Web of Science.
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    Jian Liu, Jian Lu, Xiaowu Ni, Gang Dai, Liang Zhang, "Thermal stress cleaving of silicon wafer by pulsed Nd:YAG laser," Chin. Opt. Lett. 8, 1000 (2010)

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    Paper Information

    Received: Mar. 23, 2010

    Accepted: --

    Published Online: Oct. 19, 2010

    The Author Email:

    DOI:10.3788/COL20100810.1000

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology