Laser & Infrared, Volume. 55, Issue 5, 724(2025)

Research on chip structure optimization of MEMS infrared thermopile sensor

QIAN Song-song1,2, LIN Zhen-heng1、*, XIE Hai-he1, HU Zhao-kun1,2, and NIE Yong-zhong3
Author Affiliations
  • 1Industrial College of New Engineer, Putian University, Putian 351100, China
  • 2College of Mechanical and Electrical Engineering, Fujian Agriculture and Forestry University, Fuzhou 350108, China
  • 3Xirenma United Measurement and Control (Quanzhou) Technology Co., Ltd., Quanzhou 362011, China
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    References(5)

    [3] [3] Graf A, Arndt M, Gerlach G. Seebeck's effect in micromachined thermopiles for infrared detection. a review[J]. Estonian Journal of Engineering, 2007, 13(4): 338-353.

    [5] [5] Mancarella F, Roncaglia A, Passim M, et al. Wafer-level testing of thermopile IR detectors[C]//The 4th IEEE Conference on Sensors, 2005, 2: 1133-1136.

    [6] [6] Lei C, Mao H Y, Ou W, et al. A CMOS-MEMS IR device based on double-layer thermocouples[J]. Microsystem Technologies, 2016, 22(5): 1163-1171.

    [7] [7] He Y Q, Wang Y L, Li T. Simultaneously controlling heat conduction and infrared absorption with a textured dielectric film to enhance the performance of thermopiles[J]. Microsystems & Nanoengineering, 2021, 7: 36.

    [8] [8] Xu D H, Wang Y L, Xiong B, et al. MEMS-based thermoelectric infrared sensors: a review[J]. Frontiers of Mechanical Engineering, 2017, 12(4): 557-566.

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    QIAN Song-song, LIN Zhen-heng, XIE Hai-he, HU Zhao-kun, NIE Yong-zhong. Research on chip structure optimization of MEMS infrared thermopile sensor[J]. Laser & Infrared, 2025, 55(5): 724

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    Paper Information

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    Received: Oct. 10, 2024

    Accepted: Jul. 11, 2025

    Published Online: Jul. 11, 2025

    The Author Email: LIN Zhen-heng (lintom2023@ptu.edu.cn)

    DOI:10.3969/j.issn.1001-5078.2025.05.012

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