To address the limitations of conventional four-terminal beam MEMS infrared thermopile sensors, which suffer from inefficient surface utilization leading to low fill factor and degraded performance, an improved four-end beam structure is proposed. This enhanced design optimizes chip architecture by vertically arranging thermocouple strips along the square edges of the chip and implementing a layered configuration of absorber and thermocouple layers, thereby effectively increasing the absorption area of the thermopile and enhancing the duty cycle of the device. Comparative analyses of temperature and voltage distributions between the two structures are conducted via COMSOL simulations. The test results show that the key performance parameters of the novel four-terminal beam structure chip, such as response rate and detection rate, are greatly improved compared with the traditional counterpart, with experimental results aligning closely with simulation predictions.