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Laser & Infrared, Volume. 55, Issue 6, 909(2025)

Research on the relationship between chip thickness and performance in InSb IRFPA

LIU Sen, LIU Jian-wei, ZHAO Chao, and ZHANG Lei
Author Affiliations
  • CETC Electro-Optics Technology Corporation Limited, Beijing 100015, China
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    [1] [1] Maurer T, Wilson D L, Smith S R, et al. Search and detection comparing midwave and longwave iafared[J]. Optical Engineering, 2009, 48(11): 116401.

    [2] [2] Rogalski A. Infareddetectors: an overview[J]. Infrared Physics & Technology, 2002, 43(3/5): 187-210.

    [3] [3] Rogalski A. Third-generation infrared photo detectors[J]. Optical Engineering, 2003, 42(12): 3498-3516.

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    LIU Sen, LIU Jian-wei, ZHAO Chao, ZHANG Lei. Research on the relationship between chip thickness and performance in InSb IRFPA[J]. Laser & Infrared, 2025, 55(6): 909

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    Paper Information

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    Received: Aug. 19, 2024

    Accepted: Jul. 30, 2025

    Published Online: Jul. 30, 2025

    The Author Email:

    DOI:10.3969/j.issn.1001-5078.2025.06.012

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology