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Laser & Infrared, Volume. 55, Issue 6, 909(2025)

Research on the relationship between chip thickness and performance in InSb IRFPA

LIU Sen, LIU Jian-wei, ZHAO Chao, and ZHANG Lei
Author Affiliations
  • CETC Electro-Optics Technology Corporation Limited, Beijing 100015, China
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    LIU Sen, LIU Jian-wei, ZHAO Chao, ZHANG Lei. Research on the relationship between chip thickness and performance in InSb IRFPA[J]. Laser & Infrared, 2025, 55(6): 909

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    Received: Aug. 19, 2024

    Accepted: Jul. 30, 2025

    Published Online: Jul. 30, 2025

    The Author Email:

    DOI:10.3969/j.issn.1001-5078.2025.06.012

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology