Laser & Infrared, Volume. 55, Issue 6, 909(2025)

Research on the relationship between chip thickness and performance in InSb IRFPA

LIU Sen, LIU Jian-wei, ZHAO Chao, and ZHANG Lei
Author Affiliations
  • CETC Electro-Optics Technology Corporation Limited, Beijing 100015, China
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    The signal of IRFPA is an important performance parameter, influenced by various factors. In this paper, based on the Planck’s law and considering multiple influencing factors, the signal value of a specific infrared detector is calculated. Through computation, a strong correlation is identified between the thickness of the chip and the signal of the IRFPA, which is subsequently verified experimentally. During verification, it is observed that when the chip thickness decreases, the signal value decreases to some extent, showing discrepancies with the calculated results. An analysis of these differences is conducted, and both analytical and experimental results reveal that the thinning thickness and thinning process of the detector chip exert significant impacts on detector performance. After secondary verification, the results substantially align with the analytical predictions.

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    LIU Sen, LIU Jian-wei, ZHAO Chao, ZHANG Lei. Research on the relationship between chip thickness and performance in InSb IRFPA[J]. Laser & Infrared, 2025, 55(6): 909

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    Paper Information

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    Received: Aug. 19, 2024

    Accepted: Jul. 30, 2025

    Published Online: Jul. 30, 2025

    The Author Email:

    DOI:10.3969/j.issn.1001-5078.2025.06.012

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