Chinese Optics, Volume. 16, Issue 3, 587(2023)

Development and algorithm research of optical alignment system for a high precision flip chip bonder

Bing HAN1, Hong-tao MA1, Hong-gang XU1, Ying YAN2, De-han JU1, and Chun-yu ZHAO3
Author Affiliations
  • 1Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China
  • 2The Second Research Institute of CETC, Taiyuan 030024, China
  • 3Jilin Jiangji Special Industries Co Ltd, Jilin 132000, China
  • show less
    References(16)

    [1] DING R J, YANG J R, HE L, . Development of technologies for HgCdTe IRFPA[J]. Infrared and Laser Engineering, 49, 0103010(2020).

    [2] SHEN H H, HUANG M, LI J Q, . Recent progress in aerial electro-optic payloads and their key technologies[J]. Chinese Optics, 5, 20-29(2012).

    [4] ZHOU L Q, NING T, ZHANG M, . Developments of 10 μm pixel pitch 1024×1024 MW infrared detectors[J]. Laser & Infrared, 49, 915-920(2019).

    [7] DI X Y. Development of high precision flip chip bonder[J]. Electronics Process Technology, 41, 226-229(2020).

    [11] [11] WANG X K. Accuracy design f the pricision alignment system of flip chip bonding[D]. Xi’an: Xidian University, 2013. (in Chinese)

    [15] LIU L B, LIU B, FAN CH L, . Large-scale production of 640×512 middle-wavelength infrared detectors from guide infrared company limited[J]. Infrared, 42, 8-14(2021).

    Tools

    Get Citation

    Copy Citation Text

    Bing HAN, Hong-tao MA, Hong-gang XU, Ying YAN, De-han JU, Chun-yu ZHAO. Development and algorithm research of optical alignment system for a high precision flip chip bonder[J]. Chinese Optics, 2023, 16(3): 587

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Original Article

    Received: May. 23, 2022

    Accepted: --

    Published Online: May. 31, 2023

    The Author Email:

    DOI:10.37188/CO.2022-0101

    Topics