Fig. 1. The flow chart of the flip chip bonder process

Fig. 2. The working coordinate system of the flip chip bonder

Fig. 3. The plane rotation model

Fig. 4. The optical alignment model

Fig. 5. The error model of the coordinate systems of the substrate platform and the optical alignment system

Fig. 6. The error model of the coordinate system after bonding

Fig. 7. The optical alignment system

Fig. 8. The diagram of the optical alignment system assembly

Fig. 9. Test effects of the collimation system

Fig. 10. The effect of microscopic imaging

Fig. 11. The laser ranging verification system