Optics and Precision Engineering, Volume. 33, Issue 2, 209(2025)

Development of bi-directional high overload silicon-based differential pressure sensitive element

Liqun DU1,2、*, Aoqi LI1,2, Meng LI1,2, Xiaocheng YANG1,2, Xiangyue MENG1,2, and Huifeng QIU1,2
Author Affiliations
  • 1State Key Laboratory of High-performance Precision Manufacturing,Dalian University of Technology, Dalian6024, China
  • 2Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology, Dalian11604, China
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    [6] CHUAI R Y, YANG Y X, ZHANG B et al. Overload performance study and fabrication of the capacitive pressure-sensitive chip with linkage film[J]. Review of Scientific Instruments, 93(2022).

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    Liqun DU, Aoqi LI, Meng LI, Xiaocheng YANG, Xiangyue MENG, Huifeng QIU. Development of bi-directional high overload silicon-based differential pressure sensitive element[J]. Optics and Precision Engineering, 2025, 33(2): 209

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    Paper Information

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    Received: Oct. 25, 2024

    Accepted: --

    Published Online: Apr. 30, 2025

    The Author Email: Liqun DU (duliqun@dlut.edu.cn)

    DOI:10.37188/OPE.20253302.0209

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